ISO 857-2:2005 pdf download.Welding and allied processes —Vocabulary 一 Part 2: Soldering and brazing processes and related terms.
3.1.4.2
dc-wetting
sparation of solid filler material which, although it had spread over the surfaces of the components to be joined, had tailed to bond to them because of e.g. inadequate cleaning or fluxing
3.1.4.3
flow path
distance through which the molten filler metal flows in the joint
3.1.4.4
capillary attraction
force, caused by surface tension, which draws the molten filler metal wito the gap between the components being joined, even against the force of gravity
3.1.4.5
bonding process
process by which a bond rs cxeated between the liquid phase of the filler metal and the solid parent metal due to metallurgical reaction
3.2
materials for so’dering or brazing
3.2.1
filler metal
added metal required for soldered or brazed joints. which can be in the fomi of wire, inserts, powder, pastes.
3.2.2
flux
non.metallic material which, when molten, promotes wetting by removing existing oxide or other detrimental films from the surfaces to be joined and prevents their re-fomation during the jolning operation
3.2.3
binder
substance with which filler metals and/or fluxes are bound as powders or pastes so that they can be applied to the joint as paste or can be moulded into filler metal shapes
3.2.4
soldering and brazing stop-off
substance used to prevent undesirable spreading 01 molten filler metal
3.2.5
parent material
material being brazed/soldered
3.2.6
protective atmospher. for soldering or brazing
gas atmosphere or vacuum round a component, either to remove oxide or other detnmental films on the surfaces to be joined or to prevent the re-fomiallon o( such films on surfaces which have previously been cleaned
3.2.6.1
reducing gas atmosphere
gas which reduces oxides owing to Its high affwiity for oxygen
3.2.6.2
inert gas atmosphere
gas which prevents the formation of oxides during the soldering or brazing process.
dc-wetting
sparation of solid filler material which, although it had spread over the surfaces of the components to be joined, had tailed to bond to them because of e.g. inadequate cleaning or fluxing
3.1.4.3
flow path
distance through which the molten filler metal flows in the joint
3.1.4.4
capillary attraction
force, caused by surface tension, which draws the molten filler metal wito the gap between the components being joined, even against the force of gravity
3.1.4.5
bonding process
process by which a bond rs cxeated between the liquid phase of the filler metal and the solid parent metal due to metallurgical reaction
3.2
materials for so’dering or brazing
3.2.1
filler metal
added metal required for soldered or brazed joints. which can be in the fomi of wire, inserts, powder, pastes.
3.2.2
flux
non.metallic material which, when molten, promotes wetting by removing existing oxide or other detrimental films from the surfaces to be joined and prevents their re-fomation during the jolning operation
3.2.3
binder
substance with which filler metals and/or fluxes are bound as powders or pastes so that they can be applied to the joint as paste or can be moulded into filler metal shapes
3.2.4
soldering and brazing stop-off
substance used to prevent undesirable spreading 01 molten filler metal
3.2.5
parent material
material being brazed/soldered
3.2.6
protective atmospher. for soldering or brazing
gas atmosphere or vacuum round a component, either to remove oxide or other detnmental films on the surfaces to be joined or to prevent the re-fomiallon o( such films on surfaces which have previously been cleaned
3.2.6.1
reducing gas atmosphere
gas which reduces oxides owing to Its high affwiity for oxygen
3.2.6.2
inert gas atmosphere
gas which prevents the formation of oxides during the soldering or brazing process.
